BEST Inc. provides laser depaneling services for printed circuit board manufacturers in addition to EMS and OEMs. BEST’s numerous lasers are equipped to take care of volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. This is the right strategy to use when there are actually sharp corners or many tight radii of curvature in the PCB Router or even in the flex circuit.
Based on the material and also the part requirements, BEST laser services provides a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. Employing a laser to carry out the depaneling gives the user the main advantage of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost and no cutting oils or another contaminants.
rigid flex depanelizedIn addition BEST could be that provider of laser depanelization when you have plenty of IoT devices which need to be precisely machined or cut out to put perfectly in to small mechanical enclosures.
Because of the contact-free processing that continues on with PCB Laser Cutting Machine of printed circuit boards, there is very little distortion even if thin materials are used. When boards are milled or punched out utilizing a mechanical tool there could turn out to be a loss precision and potentially a distortion from the outside board dimensions. Worse yet it could crack solder joints when working with these mechanical means. In BEST laser depanelization system feature fiducial registration and online scaling, which implies already existing distortions may be compensated as well as the cut contours positioned precisely within the layout.
Similar to scoring or v-grooves, laser perforations are another option for singulated board removal from a panel or sheet. Perforations can be laser formed to any size and spacing to meet the desired removal and securement forces.
Laser scoring can certainly produce a limited depth ablation line in the panelized boards. Generally the depth in the score line is 50% in the material thickness and might be controlled to some desired depth. The scoring acts in a manner just like the hold-tab to secure the part from the panel or sheet, but allows for individual 19dexjpky to be ‘snapped’ out after processing. Laser scoring lines could also be used as being a deliberate path for crack propagation or stress relief. When performing the score lines as a service BEST can either use the IPC guidelines or follow customer requirements.
Hold-in tabs are small uncut sections around the board which are used to secure the PCB Punching in the panel. The hold-in tabs can be used as easy handling small boards or for printed circuit board securement for added processing. The hold-in tab width is chosen in accordance with the amount of force desired to remove the part in the panel/sheet or known forces to become applied by downstream processes like component loading. BEST laser services can create tabs in many board materials as well as nearly any width and site in regards to the part.